Principles of Plasma Discharges and Materials Processing
|von Michael A. Lieberman|
From Book News, Inc. A text-reference that offers an integrated presentation of the fundamental physics and chemistry of partially ionized, chemically reactive, low-pressure plasmas and their roles in a wide range of plasma discharges and processes used in thin film processing applications, especially in the fabrication of integrated circuits. Includes many fully worked examples, practice exercises, and demonstrations of the relationship of plasma parameters to external control parameters and processing results. Annotation copyright Book News, Inc. Portland, Or.
Book Description Systematically treats the basics of plasma physics and chemistry in partially ionized, chemically reactive, low-pressure plasmas. Offers an understanding of the wide diversity of plasma discharges and procedures used in thin film processing applications, as in the fabrication of integrated circuits. Includes scores of worked examples and exercises.
Verarbeitung > Principles of Plasma Discharges and Materials Processing|